Main product is : HY-E series EPOXY MOLDING COMPOUND plastic, this product has six series(HY-E100HY-E600) and hundred varieties. It mainly uses in semiconductor(diode,audion etc.), special type apparatus (highvoltage silicon rectifier stack, small and special electrical machine etc.), plastic encapsulation of small,middle and large scale molectron(DIPSOPQFPBGA etc. style).
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 Contact Us
Tel:86-579-87403976
      87403977
Fax:86-579-87403977
Phone:1375898678
E-mail:hydz@zjhydz.com
Addxixi Yongkang City Zhejiang Province
http://www.duumnn.cn/
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1Phenolic molding plastics product characteristics and quality assurance

Project
Item
HY-E
Model
P25F
P35F
P40F
P57F
P60F
color
-
Black, green, beige
Black, green, beige
Black, green, beige
Black, green, beige
Black, green, beige
Mobility
in
3.5
4.0
4.2
3.5
8
The glass transition temperature Tg
210
210
220
235
208
Flame retardant
-
V-0
V-0
V-0
V-0
V-0
Bending strength
Mpa
230
225
200
210
195
Bending modulus
Mpa
17000
16500
15500
16000
14500
Impact strength
KJ/m2
12
13
11
10
9
The proportion of
-
1.8
1.8
1.8
1.82
1.82
Molding shrinkage
%
0.18
0.17
0.18
0.20
0.15
Water absorption rate
%
0.05
0.05
0.05
0.05
0.05
Features
-
Excellent mechanical properties
Forming, mechanical excellence
Excellent abrasion resistance
Excellent High temperature resistance
Low shrinkage, high temperature is good

2Epoxy molding compound of HY environmental protection type

Project
item
HY-EG300
HY-EG320
HY-EG460
HY-EG850
color
-
black
black
black
black
gel time(175)
Sec
17-25
18-26
24-32
26-35
spiral flow(175)
cm
60-90
70-100
90-140
90-150
specific gravity

g/cm3

1.92-2.02
1.82-1.98
1.85-2.0
1.94-1.98
Flexural strength
Mpa
140
145
135
130
Flexural modulus
Gpa
14.0
16.0
15.0
18.0
Tg
165
160
125
115
coef.below Tg 1
1/10-6
30
25
12
8
coef.below Tg2
1/10-6
76
72
50
40
Flammability
94UL
V-0
V-0
V-0
V-0
Na+
ppm
5
5
5
5
Cl-
ppm
5
5
5
5
Feature
-
green
green
green
green
application  
DIP Di,TO
Di,Bridge,TO
SOT,SOP,SSOP,TSOP,QFP
SOT,SOP,SSOP,TSOP,QFP